Technologie

Requirement attribute

Product capability

Board type: Single-, Double-sided, Multilayer, Flex, Teflon, High Freq, MetalCore,…
Number of conductive layers: up to 24
Laminate material:
  • FR4, FR4 Halogen free, CEM1, CEM3 Thermal
  • High-Speed and High-Frequency materials
  • High Tg/CTI materials
  • Al materials
  • PTFE, Rogers, Arlon, Nelco, Polyimide
Max board size in production: 610 mm x 535 mm (535 mm x 810 mm)
Total board thickness: 0,20 mm – 4,0 mm
Inner layer thickness: 0,10 mm – 1,6 mm
Min line width, space: 50 μm
Copper foil thickness on outer layers: 12 μm – 105 μm, 210 μm, 400 μm
Copper foil thickness on inner layers: 12 μm – 105 μm
Diameter of drilled holes: 0,15 mm – 6,40 mm
Finished hole diameter: 0,10 mm – 6,35 mm
Metallization aspect ratio: 12 : 1
Blind vias aspect ratio: 1 : 1
Solder resist: Green matt and glossy, Black matt and glossy, White, Blue, Red, Yellow (min. gap in fine pitch 50 μm)
Legend print: White, Green, Yellow, Black, Red, Blue
Peelable solder mask: Blue, Green
Vias filler: with solder resist
Carbon print: 40 Ohm ± 5 %
Surface finishes:
  • HAL lead-free
  • HAL tin-lead
  • Immersion NiAu (ENIG)
  • Immersion Ag
  • Immersion Tin
  • OSP
  • Hard gold
Tolerances:
  • Routing ± 0,05 mm
  • Scoring ± 0,10 mm
  • Etching ± 10 %
  • Hole tolerance (Press fit) ± 0,05 mm
Quality management:
  • UL Conformance
  • Microsection
  • Dimensional examination
  • Automated optical inspection
  • X-ray
  • Electrical testing
  • EMPB
Special features:
  • Blind via
  • Burried via
  • Press fit
  • Press fit – with back drilling
  • Controlled impedance
  • Side plating (Metal plating edges, Half holes)
  • Deep routing
  • Jump scoring
  • Countersink
  • BGA raster 0,5 mm